| Numero di modello: |
118615 |
| Nome del prodotto: |
Soldering nozzle ERSA |
| Grandezza: |
8/12, H47,B14.1 |
| Materiale: |
Titanium alloy+oxide layer |
| Use for: |
ERSA selective soldering |
| Luogo di origine: |
Shenzhen Cina |
| Lead time: |
Ceppo |
|
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How to extend ERSA selective soldering nozzle’s lifespan?
Recommended Temperature Range for Soldering Nozzle
1. Lead-Free Solder (e.g., SAC305, SAC307)
Best: 250–265°C (ideal: 260°C)
Reason: Melts at ~217–220°C; needs higher temp for flow.
Above 270°C: Faster oxidation, more spatter and dross.
2. Leaded Solder (e.g., Sn63/Pb37, Sn60/Pb40)
Best: 230–245°C (ideal: 240°C)
Reason: Melts at 183°C; too hot may cause alloy separation and dross.
3. High-Temp Lead-Free (e.g., BiSn alloy)
Special range: 270–280°C
Nota: Closely monitor nozzle condition.
Before working with nozzle, Preheating Temperature Matching
Preheat PCB to 100–130°C to reduce thermal stress on nozzle and pads.
Low preheat causes large temp gradients, requiring hotter nozzle compensation.
Nitrogen Protection (N₂)
N₂ lowers soldering temp by 5–10°C.
Also reduces dross and extends nozzle cleaning cycle.
Recommended N₂ flow: 15–25 L/min (adjust per ERSA model).
